Wafer map failure pattern classification using geometric ... - Nature
WEBMay 19, 2023 · Kyeong et al. 10 proposed mixed-type defect patterns in wafer bin maps using multiple CNN models. Yu et al. 11 proposed two stages for recognizing and classifying wafer map patterns.
Semi-supervised imbalanced classification of wafer bin map …
WEBMar 15, 2024 · Novel semi-supervised approach is proposed for wafer bin map defect classification. • The approach effectively handles imbalanced class semi-supervised classification. • Experimental results show that the proposed approach outperforms other …
An intelligent system for wafer bin map defect diagnosis: An …
WEBMay 1, 2013 · Wafer bin maps (WBMs) that show specific spatial patterns can provide clue to identify process failures in the semiconductor manufacturing. In practice, most companies rely on experienced engineers to visually find the specific WBM patterns.
Similarity searching for fault diagnosis of defect patterns in wafer ...
WEBNov 1, 2023 · Wafer bin maps (WBMs), which represent the spatial distribution of defective dies on the wafer, may contain specific defect patterns that offer useful insight into the underlying causes of anomalies in the processes.
Applied Sciences | Free Full-Text | Bin2Vec: A Better Wafer Bin Map ...
WEBFeb 11, 2019 · A wafer bin map (WBM), which is the result of an electrical die-sorting test, provides information on which bins failed what tests, and plays an important role in finding defective wafer patterns in semiconductor manufacturing.
Classification of Mixed-Type Defect Patterns in Wafer Bin Maps …
WEBMay 29, 2018 · In semiconductor manufacturing, a wafer bin map (WBM) represents the results of wafer testing for dies using a binary pass or fail value. For WBMs, defective dies are often clustered into groups of local systematic defects.
Multi-bin wafer maps defect patterns classification
WEBMulti-bin wafer maps defect patterns classification. Abstract: In semiconductor fabrication, a wafer bin map (WBM) represents wafer test results for dies using pass or fail values. Determining defective dies patterns is important because different patterns are related to different causes of failure. It is a common phenomenon that multi-bin ...
Memory testing and fail bitmap generation for fault correlation
WEBMemory electrical test results are used for correlating fail bitmap patterns with possible process defects. Hence, it becomes necessary that proper fail bitmaps are recorded during testing. This is an essential step in failure analysis to improve the process yield.
Bitmap of SRAM failure patterns. | Download Scientific Diagram
WEBSRAM bit fail maps (BFM) are routinely collected during earlier phases of yield ramping, providing a rich source of information for IC failure and deformation learning.
Shape prior guided defect pattern classification and ... - Springer
WEBNov 7, 2023 · In semiconductor manufacturing, patterns formed by defective dies in a wafer bin map (WBM) reveal possible problems during the wafer fabrication process. Therefore, the identification of these patterns is important for …
- Some results have been removed