Compound Semiconductor™ is an Angel Business Communications publication.

Infineon Technologies has announced significant progress along its 200 mm SiC roadmap, with customers receiving the first products based on the technology in Q1 2025. Manufactured in Villach, Austria, ...

Teradyne, a supplier of automated test solutions, and semiconductor firm Infineon have entered into a partnership around ...

Cree LED, a division of Penguin Solutions, has introduced the XLamp XP-L Photo Red S Line LEDs optimised for high-performance ...

Circuits Integrated Hellas (CIH), an Athens-based satcoms tech start-up, featured as a laureate startup in the Innovation ...

The TSC family has been designed to help customers achieve excellent robustness with maximum power density and system ...

GaN specialist Efficient Power Conversion Corporation (EPC) has announced the release of the 4th edition of its textbook, GaN ...

GaN specialist Efficient Power Conversion Corporation (EPC) has announced the release of the 4th edition of its textbook, GaN Power Devices for Efficient Power Conversion.

Power Integrations' CEO Balu Balakrishnan has announced his retirement once a successor is in place. Balakrishnan, 70, ...

Compound Semiconductor™ is an Angel Business Communications publication.

SemiQ Inc, a US SiC company, has announced the QSiC 1200V MOSFET, a third-generation device that shrinks die size while ...